Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.
申请公布号
US2013206602(A1)
申请公布日期
2013.08.15
申请号
US201213370181
申请日期
2012.02.09
申请人
LEE INHO;IAGODKINE ELISSEI;QIN YI;LUO YU;ROHM AND HAAS ELECTRONIC MATERIALS LLC