摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a power module which improves the discharging ability of flux when the substrate for the power module is joined to a heat sink thereby achieving high reliability in joining with the heat sink.SOLUTION: In a manufacturing method of a substrate for a power module with a heat sink, the substrate for the power module with the heat sink is manufactured by joining a heat sink to the substrate for the power module formed by joining a metal layer 13, which is to be joined to the heat sink, to a surface of a ceramic substrate. In the metal layer 13 where multiple grooves 14 are formed on a heat sink joining surface, liquid-repellent powder of BN, TiO, SiO, MgO, which lowers the wettability to a brazing material, is applied to at least parts of the heat sink joining surface and a side surface. A substrate joining surface of the metal layer 13 is brazed with the ceramic substrate and the substrate for the power module is formed. The heat sink joining surface of the metal layer 13 is joined to the heat sink by brazing using flux. |