发明名称 MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a power module which improves the discharging ability of flux when the substrate for the power module is joined to a heat sink thereby achieving high reliability in joining with the heat sink.SOLUTION: In a manufacturing method of a substrate for a power module with a heat sink, the substrate for the power module with the heat sink is manufactured by joining a heat sink to the substrate for the power module formed by joining a metal layer 13, which is to be joined to the heat sink, to a surface of a ceramic substrate. In the metal layer 13 where multiple grooves 14 are formed on a heat sink joining surface, liquid-repellent powder of BN, TiO, SiO, MgO, which lowers the wettability to a brazing material, is applied to at least parts of the heat sink joining surface and a side surface. A substrate joining surface of the metal layer 13 is brazed with the ceramic substrate and the substrate for the power module is formed. The heat sink joining surface of the metal layer 13 is joined to the heat sink by brazing using flux.
申请公布号 JP2013157361(A) 申请公布日期 2013.08.15
申请号 JP20120014646 申请日期 2012.01.26
申请人 MITSUBISHI MATERIALS CORP 发明人 AOKI SHINSUKE;NAGASE TOSHIYUKI
分类号 H01L23/40;H01L23/12;H01L23/36 主分类号 H01L23/40
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