发明名称 |
Hermetically Sealed Electronic Device Using Solder Bonding |
摘要 |
Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications. |
申请公布号 |
US2013206230(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201113808571 |
申请日期 |
2011.07.22 |
申请人 |
SRIDHARAN SRINIVASAN;BLONSKI ROBERT P.;KHADILKAR CHANDRASHEKHAR;MALONEY JOHN J.;FERRO CORPORATION |
发明人 |
SRIDHARAN SRINIVASAN;BLONSKI ROBERT P.;KHADILKAR CHANDRASHEKHAR;MALONEY JOHN J. |
分类号 |
B23K1/19;B23K31/02;H01L31/048;H01L31/18;H05K13/00 |
主分类号 |
B23K1/19 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|