发明名称 |
ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF |
摘要 |
An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.
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申请公布号 |
US2013207277(A1) |
申请公布日期 |
2013.08.15 |
申请号 |
US201013703810 |
申请日期 |
2010.06.21 |
申请人 |
NODA NAOKI;KOARAI MITSURU;YOKOUCHI TOSHIO;ISHIMORI MASAHIRO;PIONEER MICRO TECHNOLOGY CORPORATION;PIONEER CORPORATION |
发明人 |
NODA NAOKI;KOARAI MITSURU;YOKOUCHI TOSHIO;ISHIMORI MASAHIRO |
分类号 |
H01L23/538;H01L21/02 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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