| 摘要 |
PROBLEM TO BE SOLVED: To accurately planarize a rear face of a semiconductor wafer after grinding, when a rear face of a semiconductor wafer having irregularities on a surface thereof is ground.SOLUTION: A sticking device includes: resin coating means (91) for coating a surface of a wafer transported from a cassette (61) housing the wafer with resin being cured with an application of an external stimulus; resin semi-curing means (92) for bringing the resin coated on the surface of the wafer into a semi-cured state where adhesiveness remains; resin surface planarization means for cutting a predetermined thickness from the surface side of the semi-cured resin to planarize the surface of the resin; and support substrate sticking means (10) for press-bonding a support substrate on the surface of the planarized resin and completely curing the resin to stick the support substrate on the surface of the wafer. |
