HEAT SINK WITH LAMINATED FINS AND METHOD FOR PRODUCTION OF SUCH A HEAT SINK

摘要

A heat sink (1) for cooling of an electronic device is described. The heat sink comprises a heat sink base (2) with a contact surface (3) to be attached to an electronic device and a number of heat sink fins (4) arranged on the heat sink base (2). The heat sink fins (4) comprise a laminate (21) comprising at least one carbon layer (5) with a layer of sheet metal (6, 7) on each side of the carbon layer (5). A method for production of such a heat sink is also described.