| 摘要 |
This defect inspection device detects the position of a defect in wiring formed on a panel, and comprises a probe for applying a voltage to a terminal part of the wiring, a probe movement means for moving the probe to the terminal part, a first infrared sensor for imaging the entire surface of the panel, a second infrared sensor for imaging a local part of the panel, and a sensor movement means for moving the second infrared sensor to each position on the panel, the first infrared sensor being configured from a plurality of infrared cameras. |
