发明名称 |
Electronic device housing and method for making the same |
摘要 |
An electronic device housing is provided. The electronic device housing includes a substrate, a first metallic coating formed on the substrate, and a second metallic coating formed on a portion of the first metallic coating. The first and second metallic coatings are formed by vacuum sputtering or vacuum vapor deposition. The first and second metallic coatings are all non-conductive. A method for making the electronic device housing is also described there.
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申请公布号 |
US8507107(B2) |
申请公布日期 |
2013.08.13 |
申请号 |
US20100949955 |
申请日期 |
2010.11.19 |
申请人 |
DU QI-JIAN;CHIANG CHWAN-HWA;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.;FIH (HONG KONG) LIMITED |
发明人 |
DU QI-JIAN;CHIANG CHWAN-HWA |
分类号 |
B32B9/00;B22D11/00;B32B1/00;B32B3/00;B32B15/00;H02B1/00 |
主分类号 |
B32B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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