发明名称 Substrate processing system
摘要 Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.
申请公布号 US8506714(B2) 申请公布日期 2013.08.13
申请号 US20070990499 申请日期 2007.01.24
申请人 HORITA TOMOKI;HIRAHARA KAZUHIRO;MIYA HIRONOBU;SUDA ATSUHIKO;YAMAZAKI HIROHISA;HITACHI KOKUSAI ELECTRIC INC. 发明人 HORITA TOMOKI;HIRAHARA KAZUHIRO;MIYA HIRONOBU;SUDA ATSUHIKO;YAMAZAKI HIROHISA
分类号 C23C16/455;C23C16/06;C23C16/22;C23C16/453;C23C16/52 主分类号 C23C16/455
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