发明名称 PROBE
摘要 PURPOSE: A probe is provided to test the semiconductor device by using other wires of a bundle of wires even when at least one of the wires is worn or damaged, thereby extending the life of the probe. CONSTITUTION: An upper plunger (20) is electrically connected to a semiconductor device (2). A lower plunger (40) is electrically connected to a tester (6). An internal elastic member (60) elastically biases at least one of the upper plunger and the lower plunger to allow the upper plunger and the lower plunger to be spaced apart from each other. A barrel (80) receives the internal elastic member. The at least one of the upper plunger and the lower plunger is made of metal materials and includes a receiving groove (22) in the end portion thereof. A bundle (24) of conductive wires is arranged on the receiving groove to expose a part of the bundle.
申请公布号 KR20130089336(A) 申请公布日期 2013.08.12
申请号 KR20120010615 申请日期 2012.02.02
申请人 LEENO IND. INC. 发明人 I, CHAE YUN
分类号 G01R1/067;G01R31/26;H01L21/66 主分类号 G01R1/067
代理机构 代理人
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