发明名称 |
CHIP WITH INTEGRATED CIRCUIT AND MICRO-SILICON CONDENSER MICROPHONE INTEGRATED ON SINGLE SUBSTRATE AND METHOD FOR MAKING THE SAME |
摘要 |
A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base (20) having a first area (21) and a second area (22); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer (26) and a medium insulation layer (25c) extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer (32) above the SOI base; S5) forming a Poly Sil-xGex film (33) on the sacrificial layer; S6) forming a back cavity (34); and S7) eroding the sacrificial layer to form a chamber (36) in communication with the back cavity. Besides, a chip (10) fabricated by the above method is also disclosed.
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申请公布号 |
US2013202136(A1) |
申请公布日期 |
2013.08.08 |
申请号 |
US201213561194 |
申请日期 |
2012.07.30 |
申请人 |
HU WEI;LI GANG;MEI JIA-XIN;MEMSENSING MICROSYSTEMS TECHNOLOGY CO., LTD. |
发明人 |
HU WEI;LI GANG;MEI JIA-XIN |
分类号 |
H04R1/00;H01L21/02 |
主分类号 |
H04R1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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