| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an aggregate substrate capable of reducing problems such as that an aggregate substrate which is in production is caught in a transport conveyor.SOLUTION: The method for manufacturing an aggregate substrate comprises the steps of: preparing an insulating layer with a first copper foil to which a first copper foil of 30 μm or above in thickness is attached under a first insulating layer 1 of 60 μm or below in thickness; forming a first wiring conductor 2 on the first insulating layer 1; laminating an insulating layer with a second copper foil in which a second copper foil of 30 μm or above in thickness is attached to a second insulating layer 3 of 60 μm or below in thickness on the insulating layer with the first copper foil; forming at least one of the first copper foil and the second copper foil in a frame-like shape and exposing a central part of at least one of the first insulating layer 1 and the second insulating layer 3; forming a via hole 7 reaching the first wiring conductor 2 on at least one of the first insulating layer 1 and the second insulating layer 3; and forming a second wiring conductor 5 on a surface of at least one of the first insulating layer 1 and the second insulating layer 3 including the via hole 7. |
