| 摘要 |
<p>The invention described herein consists of a process that enables increased adhesion of thin film materials (such as metals, metal oxides, carbon nanotubes or other materials) to solvent and temperature sensitive, and non-planar, polymer substrates and the fabrication of softening electronics. Importantly, this process can be used to create exceptional embodiments of the disclosed flexible electronic devices having dynamic properties that make them suitable for implantation in the human body.</p> |
