发明名称 |
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a method for manufacturing the same, capable of suppressing a decrease in printing discrimination and a decrease in fraction defective of the electronic component while reducing the height of the electronic component.SOLUTION: A method for manufacturing an electronic component comprises the steps of: mounting an electronic element 2 on a substrate 1; forming a resin part 4 for sealing the electronic element 2 mounted on the substrate 1; forming a grinding surface by grinding the resin part 4; forming a print pattern 4A by processing the grinding surface with a laser; and forming a coating layer 5 on the grinding surface on which the print pattern 4A is formed. |
申请公布号 |
JP2013153007(A) |
申请公布日期 |
2013.08.08 |
申请号 |
JP20120012094 |
申请日期 |
2012.01.24 |
申请人 |
MURATA MFG CO LTD |
发明人 |
YOSHIDA KAZUHIRO;SHINKAI HIDEKI |
分类号 |
H01L23/00;B23K26/00;H01L21/56 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|