发明名称 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic component and a method for manufacturing the same, capable of suppressing a decrease in printing discrimination and a decrease in fraction defective of the electronic component while reducing the height of the electronic component.SOLUTION: A method for manufacturing an electronic component comprises the steps of: mounting an electronic element 2 on a substrate 1; forming a resin part 4 for sealing the electronic element 2 mounted on the substrate 1; forming a grinding surface by grinding the resin part 4; forming a print pattern 4A by processing the grinding surface with a laser; and forming a coating layer 5 on the grinding surface on which the print pattern 4A is formed.
申请公布号 JP2013153007(A) 申请公布日期 2013.08.08
申请号 JP20120012094 申请日期 2012.01.24
申请人 MURATA MFG CO LTD 发明人 YOSHIDA KAZUHIRO;SHINKAI HIDEKI
分类号 H01L23/00;B23K26/00;H01L21/56 主分类号 H01L23/00
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