发明名称 CONDUCTIVE ADHESIVE AND ELECTRONIC DEVICE USING SAME
摘要 <p>[Problem] To provide: a conductive adhesive which is not susceptible to deterioration in a bonded portion caused by a halogen; and an electronic device which uses the conductive adhesive. [Solution] A conductive adhesive, which contains a conductive filler and a binder resin, and wherein the binder resin contains an epoxy resin in which the sum of the total chlorine concentration and the total bromine concentration is 300 ppm by mass or less relative to the total amount of the epoxy resin contained in the binder resin. This epoxy resin preferably has a sum of the total chlorine concentration and the total bromine concentration of 50 ppm by mass or less, and is preferably obtained by epoxidizing a carbon-carbon double bond of a starting material compound (a base material) that has a carbon-carbon double bond, while using hydrogen peroxide as an oxidant.</p>
申请公布号 WO2013115360(A1) 申请公布日期 2013.08.08
申请号 WO2013JP52348 申请日期 2013.02.01
申请人 SHOWA DENKO K.K.;OSAKA UNIVERSITY 发明人 UCHIDA HIROSHI;SHINOZAKI KENJI;ISHIBASHI YOSHITAKA;SUGANUMA KATSUAKI
分类号 C09J163/00;C09J9/02;C09J11/04;H01B1/00;H01B1/20;H05K3/32 主分类号 C09J163/00
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