| 摘要 |
<p>The present invention provides a multi-layer flexible printed circuit board which is capable of carrying narrow space length high-density CSP and a method for manufacturing the same. The multi-layer flexible printed circuit board comprises a three-layered structure lamination layer on at least one single surface of a core substrate of which two surfaces are provided with wiring pattern, and is characterized in that the a first conductive layer (7) of the first layer from the outer side of the lamination layer is provided with an installation solder pad (34) for installing a chip level packaging, a second conductive layer (2) of the second layer from the outer side of the lamination layer is provided with a grounding layer which at least is below the zone carrying the chip level packaging, a third conductive layer of the third layer from the outer side of the lamination layer is provided with wiring pattern for leading and winding a signal circuit, the wiring pattern is conducted by jumping a jumping conducting hole (28) of the grounding layer of the second conductive layer from the installation solder pad, the jumping conducting hole is a blind hole with a bottom and the bottom is connected with the back surface of the installation solder pad of the first conductive layer, and the multi-layer flexible printed circuit board is also provided with a conducting holes (40) of the conducting lamination layer and the core substrate (21) besides the jumping conducting hole, and a flexible cable part which is integrated with the lamination layer.</p> |
