发明名称 |
Printed circuit board and method of manufacturing printed circuit board |
摘要 |
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength. <IMAGE> |
申请公布号 |
EP2081419(B1) |
申请公布日期 |
2013.08.07 |
申请号 |
EP20090156903 |
申请日期 |
2000.09.01 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
INAGAKI, YASUSHI;ASAI, MOTOO;WANG, DONGDONG;YABASHI, HIDEO;SHIRAI, SEIJI |
分类号 |
H05K1/18;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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