发明名称 Preparation method for full-isolated SOI with hybrid crystal orientations
摘要 A preparation method for a full-isolated silicon on insulator (SOI) substrate with hybrid crystal orientations and a preparation method of a complementary metal oxide semiconductor (CMOS) integrated circuit (IC) based on the method are disclosed. In the preparation method for the full-isolated SOI substrate with hybrid crystal orientations provided in the present invention, a SiGe layer is adopted to serve as an epitaxial virtual substrate layer with a first crystal orientation, so as to form a strained top silicon with the first crystal orientation; a polysilicon supporting material is adopted to serve as a support for connecting the top silicon with the first crystal orientation and a top silicon with a second crystal orientation, so that the SiGe layer below the strained top silicon with the first crystal orientation may be removed, and an insulating material is filled to form an insulating buried layer. The top silicon and the insulating buried layer formed in the method have uniform and controllable thickness, the strained silicon formed in the window and the top silicon outside the window have different crystal orientations, so as to provide higher mobility for the NMOS and the PMOS respectively, thereby improving the performance of the CMOS IC.
申请公布号 US8501577(B2) 申请公布日期 2013.08.06
申请号 US201213636126 申请日期 2012.05.16
申请人 BIAN JIANTAO;DI ZENGFENG;ZHANG MIAO;SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATIONTECHNOLOGY, CHINESE ACADEMY OF SCIENCES 发明人 BIAN JIANTAO;DI ZENGFENG;ZHANG MIAO
分类号 H01L21/76 主分类号 H01L21/76
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