发明名称 Method of forming an electrically conductive printed line
摘要 Printed conductive lines and a method of preparing them using polymer nanocomposites with low resistivity and high current carrying capacity. Plasma treatment selectively removes polymers/organics from nanocomposites. Subsequent selective metal is deposited on top of the exposed metal surface of the printed conductive lines in order to improve current carrying capacity of the conductive printed lines. The printed conductive lines use a conductive ink or printing process and are then cured thermally and/or by a lamination process. Next, the printed conductive lines are treated with the plasma for 5-15 minutes in order to remove organics. E-less copper (Cu) is selectively deposited only at the conducting particle surface of the printed conductive lines. If desired, e-less gold, silver, tin, or tin-lead can be deposited on top of the e-less Cu.
申请公布号 US8499445(B1) 申请公布日期 2013.08.06
申请号 US201113184699 申请日期 2011.07.18
申请人 DAS RABINDRA N.;EGITTO FRANK D.;MARKOVICH VOYA R.;ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;EGITTO FRANK D.;MARKOVICH VOYA R.
分类号 H05K3/40 主分类号 H05K3/40
代理机构 代理人
主权项
地址