发明名称 |
Wiring board, semiconductor apparatus and method of manufacturing them |
摘要 |
There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step.
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申请公布号 |
US8502398(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20080244232 |
申请日期 |
2008.10.02 |
申请人 |
KANEKO KENTARO;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KANEKO KENTARO |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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