发明名称 Transfer pin of mold using shrink fit
摘要 PURPOSE: A mold transferring pin using a shrink fit and a manufacturing method thereof are provided to reduce a material loss caused by cutting a round bar and to reduce manufacturing time and costs as a pin body and a head ring are joined by the shrinkage fitting without cutting the round bar. CONSTITUTION: A mold transferring pin using a shrink fit comprises a head ring groove(11), a head ring support(15), and a head ring(20). The head ring groove is concavely formed in one side of a pin body(10), and the head ring is fixed by being shrink-fitted. The head ring support is arranged in one side of the pin body and formed by being protruded in the outer side of the pin body. The head ring is seated on the head ring groove by a shrink fit method and supported by being hung on the head ring support.
申请公布号 KR101293796(B1) 申请公布日期 2013.08.06
申请号 KR20110077422 申请日期 2011.08.03
申请人 发明人
分类号 B21D39/00;B23P11/00;B23P19/00;B23P19/02 主分类号 B21D39/00
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