发明名称 SHEET FOR CONVEYING ELECTRONIC COMPONENT, HOLDING BODY, HOUSING BODY, AND ELECTRONIC COMPONENT HOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sheet for conveying an electronic component capable of reducing a waste amount after usage at high housing efficiency when minute electronic components are housed and conveyed, a holding body, a housing body, and an electronic component holding method.SOLUTION: A sheet 10 for conveying an electronic component according to the present invention comprises: a substrate sheet 11 having flexibility, and an adhesive layer 12 provided on the substrate sheet 11. In a holding body 20 according to the present invention, electronic components 21 are adhered and fixed to a surface of the adhesive layer 12 of the sheet 10 for conveying the electronic component according to the present invention. In a housing body according to the present invention, the holding body 20 according to the present invention is housed in a protection case. In an electronic component holding method according to the present invention, the electronic components 21 are adhered and fixed to the surface of the adhesive layer 12 of the sheet 10 for conveying the electronic component according to the present invention, so as to obtain the holding body 20.
申请公布号 JP2013149735(A) 申请公布日期 2013.08.01
申请号 JP20120008132 申请日期 2012.01.18
申请人 SHIN ETSU POLYMER CO LTD 发明人 TANAKA KIYOFUMI
分类号 H05K13/02;B65D73/00;B65D73/02;B65D85/86;H01L21/673 主分类号 H05K13/02
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