| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive silicone composition having excellent compressibility, insulation properties, thermal conductivity and processability, particularly thermal conductivity of ≥3.0 W/mK, wherein the silicone composition is suitably used as a heat-conductive resin molded articles for heat radiation, e.g., installed between an exothermic component and a heat radiation component in an electronic device; and to provide its cured product.SOLUTION: A heat-conductive silicone composition includes (A) an organopolysiloxane having at least two alkenyl groups in one molecule, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each directly binding to a silicon atom, (C) a heat-conductive filler and (D) a platinum group metal-based curing catalyst, wherein the component (C), the heat-conductive filler, comprises (C-i) amorphous alumina with 10-30 μm average particle diameter, (C-ii) spherical alumina with 30-85 μm average particle diameter, and (C-iii) a specific amount of an insulating inorganic filler with 0.1-6 μm average particle diameter. |
