发明名称 COMBINATION OF IC TAG AND STICKING OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a combination of an IC tag and a sticking object, capable of obtaining sufficient adhesion strength even when miniaturized.SOLUTION: For the combination of the IC tag and the sticking object, an IC tag 80 includes a body part 11 including an inlet, a bonding surface to be bonded to a sticking object 300 and a flange part 82 formed on at least part of an outer periphery of the body part 11. The flange part 82 is formed by being extended in parallel in three directions orthogonal to each other, a rough surface S is formed on at least part of the bonding surface, one surface of the flange part 82 in a thickness direction of the IC tag 80 becomes the bonding surface, and the sticking object 300 has a recessed corner part formed by surfaces extending in parallel in three directions orthogonal to each other.
申请公布号 JP2013149281(A) 申请公布日期 2013.08.01
申请号 JP20130087774 申请日期 2013.04.18
申请人 DAINIPPON PRINTING CO LTD 发明人 OKADA SHINICHI;ARAKI NOBORU
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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