| 摘要 |
PROBLEM TO BE SOLVED: To implement space saving while maintaining inductance of a coil and a cooling function of a heat sink as further as possible.SOLUTION: An electronic apparatus is provided which comprises a semiconductor device 1, a coil 3A connected to the semiconductor device 1 and a metal block 4 used as a heat sink of the semiconductor device 1. In the metal block 4, a hole part 50 is formed for inserting at least a portion of the coil 3A thereto. The coil 3A is inserted into the hole part 50 in such a manner that one end portion of the coil 3A is opposed to a bottom surface 50BS of the hole part 50. Further, in the metal block 4, a penetration slit 8 penetrating a side surface portion 50S of the hole part 50 and a through hole 9 penetrating a part of a bottom face portion 50B of the hole part 50 and connected to the penetration slit 8 are formed. The penetration slit 8 reaches an opening 9A of a through hole 9 at a side opposed to the hole part 50, from an inlet opening 50E of the hole part 50 so as to divide side face portions 50S, 9S of the hole part 50 and the through hole 9. |
