发明名称 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING MODULE
摘要 Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.
申请公布号 US2013193464(A1) 申请公布日期 2013.08.01
申请号 US201313732628 申请日期 2013.01.02
申请人 BAE SEOK HUN;CHOI SEOK BEOM;KANG PIL GEUN;HWANG DEOK KI;HAN YOUNG JU;CHOI HEE SEOK;PARK YOUNG ROK;LEE TAE DON;OH HYUN SUNG;JOO JEE HUE;KANG DONG WOO;KIM SUNG SIG 发明人 BAE SEOK HUN;CHOI SEOK BEOM;KANG PIL GEUN;HWANG DEOK KI;HAN YOUNG JU;CHOI HEE SEOK;PARK YOUNG ROK;LEE TAE DON;OH HYUN SUNG;JOO JEE HUE;KANG DONG WOO;KIM SUNG SIG
分类号 H01L33/40 主分类号 H01L33/40
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