发明名称 PEELING APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a peeling apparatus capable of precisely inserting a knife into an interface.SOLUTION: In a peeling apparatus 10 peeling a substrate 2A and a reinforcing plate 3A stuck on the substrate 2A, the peeling apparatus includes: a knife 20 inserted into an interface 8A between the substrate 2A and a first major surface 3Ab of the reinforcing plate 3A; adjustment parts adjusting an interval WA between a cutting edge 20a of the knife 20 and the interface 8 in a perpendicular direction with respect to the interface 8A before inserting the knife 20; a position detection part detecting a relative position (including a distance LA) between the cutting edge 20a of the knife 20 and a second major surface 3Aa opposite the first major surface 3Ab of the reinforcing plate 3A in the perpendicular direction with respect to the interface 8A; a plate thickness detection part 60A detecting a plate thickness DA of the reinforcing plate 3A; and an adjustment processing part 84 for operating the adjustment parts 30, 40 on the basis of a detection result of the position detection part and a detection result of the plate thickness detection part 60A.
申请公布号 JP2013147325(A) 申请公布日期 2013.08.01
申请号 JP20120009347 申请日期 2012.01.19
申请人 ASAHI GLASS CO LTD 发明人 TAKIUCHI KEI;ITO YASUNORI;ISHINO AKIHISA
分类号 B65H41/00;H01L21/683 主分类号 B65H41/00
代理机构 代理人
主权项
地址