| 摘要 |
A liquid metal ion source (110), as well as a related system (100) and method are disclosed. The liquid metal ion source can include a sputter shield (120) that comprises an alloy containing the same metal as the liquid metal ion source, a sputter shield configured to have a positive voltage applied thereto, and/or a gas handling system configured to control the constituent(s) of a gas introduced to the liquid metal ion source, as well as the gas pressure of the gas introduced to the ion source. |
