MOULDED ELECTROTECHNICAL PROTECTION COMPONENT

摘要

Molded electrical protection component with encapsulation devices suited to protect the component against ingress of solid objects and fluids, where the encapsulation devices comprise molding compound that surround parts of the component in order to contribute to achieve an improved degree of encapsulation, and where the molded component further comprises safety devices for handling of ionized gas formed in the case of short circuit currents in the protection component, and a corresponding method.