| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal conduction member with a high thermal conductivity capable of relaxing stress generated due to heat generation in an element, and to provide a semiconductor device having the same.SOLUTION: A thermal conduction member includes a main convex part 12 formed on at least one of a reference surface 11 and a rear side reference surface 14. The main convex part 12 is formed at a central part of the reference surface 11 or the rear side reference surface 14. An area of top of the main convex part 12 occupying on the reference surface 11 or the rear side reference surface 14 is 20% or more and 90% or less of an area of the reference surface 11 or the rear side reference surface 14. An entire periphery of the reference surface 11 or the read side reference surface 14 on which the main convex part 12 is formed is lower than a level of the top part. A height difference between the highest part of the top part and the lowest part of the periphery is 1/400 or more of a distance between a centroid of the reference surface 11 or the rear side reference surface 14 and the most distant periphery from the centroid. |
