发明名称 METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 According to one embodiment, a method is disclosed for manufacturing a semiconductor device. The method can rinse a substrate with water, a plurality of protruding patterns being formed on the substrate. The method can dry the substrate by removing water from a recess between the protruding patterns by irradiating microwaves.
申请公布号 US2013196512(A1) 申请公布日期 2013.08.01
申请号 US201213595076 申请日期 2012.08.27
申请人 KOIDE TATSUHIKO;OGAWA YOSHIHIRO;UOZUMI YOSHIHIRO 发明人 KOIDE TATSUHIKO;OGAWA YOSHIHIRO;UOZUMI YOSHIHIRO
分类号 H01L21/306;B08B3/00 主分类号 H01L21/306
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