POLYMER THICK FILM SOLDER ALLOY CONDUCTOR COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a polymer thick film solder alloy conductor composition.SOLUTION: There is provided a polymer thick film solder alloy conductor composition including: (a) 65 to 95 wt.% of a solder alloy powder comprising tin, silver and copper and having an average particle size of 2 to 18 μm and a surface area/mass ratio of 0.20 to 1.3 m/g; dispersed in (b) 5-35 wt.% of an organic medium comprising (i) a vinyl copolymer resin of vinylidene chloride and acrylonitrile, dissolved in (2) an organic solvent containing a dibasic ester.