HIGH VOLTAGE MODULE

摘要

PROBLEM TO BE SOLVED: To provide a high voltage module whose insulation performance is sufficiently improved without changing the electric field intensity around an insulating substrate and without the use of materials other than a gel insulator.SOLUTION: The high voltage module comprises: a circuit board 4 in which a front metal substrate 2 is bonded to a front face of an insulating substrate 1 and a rear metal substrate 3 having a ground potential is bonded to a rear face of the insulating substrate 1; a semiconductor device 5 mounted on the front metal substrate 2; an outer enclosure case 52A arranged around the circuit board 4 and the semiconductor device 5; and a gel insulator 6 which is poured in the outer enclosure case 52A so as to cover at least the circuit board 4 and the semiconductor device 5. A gas 12 in a space above the gel insulator 6 in the outer enclosure case 52A is sealed in a pressurized state to thereby pressurize the gel insulator 6.