| 摘要 |
A luminescent element module (40) which comprises a base (1), a luminescent element (LED bare chip (20)) disposed thereon, and a first encapsulant (31) and a second encapsulant (32) which have been superposed in this order on the element. In order to prevent reflection at the interface (33) between the first encapsulant (31) and the second encapsulant (32) and thereby improve the efficiency of light extraction from the luminescent element, the interface (33) between a first encapsulating resin material (31o) and a second encapsulating resin material (32o) is made gradational before the first encapsulating resin material (31o) and the second encapsulating resin material (32o) are completely cured. |
