发明名称 |
HIGH-STRENGTH COPPER ALLOY PLATE EXCELLENT IN OXIDE FILM ADHESIVENESS |
摘要 |
<p>The present invention is a Cu-Fe-P system copper alloy plate comprising Fe: 0.02-0.5% and P: 0.01-0.25% in mass % with the balance consisting of copper and unavoidable impurities and having the ratio Fe/P of Fe to Pin mass % being 2.0 to 5.0, wherein: a ratio of the area of fine crystal grains less than 0.5 p.m in equivalent circle diameter to an observation area when a surface is observed by EBSD analysis is 0.90 or less; and the ratio Cls/Cu2p of a peak area of Cis to a peak area of Cu2p on the surface by XPS analysis is 0.35 or less. No Figure</p> |
申请公布号 |
SG191491(A1) |
申请公布日期 |
2013.07.31 |
申请号 |
SG20120087532 |
申请日期 |
2012.11.28 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) |
发明人 |
RYOICHI OZAKI |
分类号 |
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代理机构 |
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代理人 |
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