| 摘要 |
A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells each having a width W, which are electrically interconnected in series by interconnect structures. The dividing of the cells and the formation of the interconnect structures between adjacent cells are carried out by a process head which is arranged to operate on more than one interconnect structure at a time in a sequence of passes to and fro over the device, the process head performing the following steps: a) making a first cut through the first, second and third layers; b) making a second cut through the second and third layers, the second cut being adjacent to the first cut; c) making a third cut through the third layer the third cut being adjacent to the second cut and on the opposite side of the second cut to the first cut; d) using a first ink jet print head to deposit a non-conducting material into the first cut; and e) using a second ink jet print head to apply conducting material to bridge the non-conducting material in the first cut and either fully or partially fill the second cut such to form an electrical connection between the first layer and the third layer, wherein step (a) precedes step (d), step (d) precedes step (e) and step (b) precedes step (e), (otherwise the steps may be carried out in any order in the single pass of the process head across the device). The thin film device may be a solar panel, a lighting panel or a battery. |
