| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor package and the semiconductor package are provided to reduce the time needed for a package process by performing a TSV process and a passivation process at the same time. CONSTITUTION: A semiconductor die(10), an antenna conductor(20), and tape(30) are prepared. The semiconductor die and the antenna conductor are adhered to one side of the tape. The semiconductor die and the antenna conductor are fixed to the tape. A first pad(11) and a second pad(12) are formed in one side of the semiconductor die. A passivation layer(40) is formed on the other side of the semiconductor die and one side of the antenna conductor.</p> |
