发明名称 Heat pump module and drying apparatus using the same
摘要 A heat pump module and a drying apparatus having the same are provided. The heat pump module may include a housing, an evaporator provided in the housing that condenses humid air introduced into the housing via evaporation of a refrigerant, a condenser provided in the housing that heats the air having passed through the evaporator via condensation of the refrigerant, and at least one condensed water guide or remover provided in the housing that removes condensed water generated on a surface of the evaporator therefrom.
申请公布号 US8495822(B2) 申请公布日期 2013.07.30
申请号 US20100700190 申请日期 2010.02.04
申请人 KIM NA EUN;KO CHEOL SOO;KIM YOUNG MIN;LG ELECTRONICS INC. 发明人 KIM NA EUN;KO CHEOL SOO;KIM YOUNG MIN
分类号 F26B21/06;F25B13/00;F25D21/00;F26B11/02 主分类号 F26B21/06
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