发明名称 IC package with embedded phased array antenna
摘要 Aspects of a method and system for configurable antenna in an integrated circuit package are provided. In this regard, a phased array antenna embedded in a multi-layer integrated circuit (IC) package may be utilized for transmitting and/or receiving signals. An IC enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package and may be controlled via an IC bonded to the multi-layer IC package. The phased array antenna may comprise a plurality of antenna elements which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver, a feeder line, a quarter wavelength transformer, and a radiating portion (e.g., a folded dipole).
申请公布号 US8497805(B2) 申请公布日期 2013.07.30
申请号 US201213491310 申请日期 2012.06.07
申请人 ROFOUGARAN AHMADREZA;ROFOUGARAN MARYAM;BROADCOM CORPORATION 发明人 ROFOUGARAN AHMADREZA;ROFOUGARAN MARYAM
分类号 H01Q1/38 主分类号 H01Q1/38
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