| 摘要 |
The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus. |
