发明名称 LIGHT-EMITTING DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deposition method and a light-emitting device manufacturing method, which can smoothly obtain an intended pattern of a material layer while improving throughput when a plurality of material layers different from one another on a substrate are stacked.SOLUTION: A light-emitting device manufacturing method comprises: preliminarily and selectively forming material layers by a pump pressure layer at positions which overlap a light absorption layer on a first substrate; depositing three kinds of luminescent layers on a single substrate; arranging the first substrate so as to face a second substrate to be a deposited substrate; and irradiating the light absorption layer with light to heat the light absorption layer and performing deposition on the second substrate. By only performing position alignment one time before the irradiation, the three kinds of luminescent layers can be deposited with high positional accuracy.
申请公布号 JP2013145766(A) 申请公布日期 2013.07.25
申请号 JP20130096260 申请日期 2013.05.01
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;TANAKA KOICHIRO;IKEDA TOSHIO;SEO TETSUSHI
分类号 H05B33/10;H01L51/50;H05B33/02;H05B33/26 主分类号 H05B33/10
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