发明名称 |
WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE |
摘要 |
There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer.
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申请公布号 |
US2013188361(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201313749070 |
申请日期 |
2013.01.24 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAMATSU SHIGETSUGU;SHIMIZU HIROSHI;HORIKAWA YASUYOSHI |
分类号 |
H05K7/20;F21V7/00;H05K3/46 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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