发明名称 METHOD AND APPARATUS FOR CMP CONDITIONING
摘要 A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide "cool" cutting action on the pad surface.
申请公布号 US2013189906(A1) 申请公布日期 2013.07.25
申请号 US201313785845 申请日期 2013.03.05
申请人 BAJAJ RAJEEV 发明人 BAJAJ RAJEEV
分类号 B24B53/017 主分类号 B24B53/017
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