| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a method for forming an insulating film which can increase a deposition rate of the insulating film and improve film thickness distribution by controlling electrical interference between targets.SOLUTION: The sputtering apparatus 10 includes: a vacuum chamber 11; a plurality of targets of insulation 21-21which are aligned in the same plane in the vacuum chamber 11 and whose sputtering surfaces are oriented in the same direction; and a power supply part 15 which applies AC voltage of the same periodicity to respective targets, wherein sputtered particles sputtered from the respective sputtering surfaces reach substrates 30a-30d opposed to the respective sputtering surfaces. The sputtering apparatus 10 includes a phase difference determination part 17 which determines the phase difference among the targets 21-21of the AC voltage applied to the respective targets 21-21, and is structured so that the power supply part 15 applies the AC voltage to the respective targets 21-21according to the phase difference determined by the phase difference determination part 17. |
