首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JP5242925(B2)
申请公布日期
2013.07.24
申请号
JP20070055893
申请日期
2007.03.06
申请人
发明人
分类号
H02K19/22;H02K1/24
主分类号
H02K19/22
代理机构
代理人
主权项
地址
您可能感兴趣的专利
FORMATION OF BUMP AND METHOD FOR MOUNTING CHIP WITH BUMP
LIGHT AMPLIFIER AND MAGNETIC DISK DEVICE
FORMATION OF PARTS FOR THREE-DIMENSIONAL CIRCUIT AND PARTS FOR THREE-DIMENSIONAL CIRCUIT
METALLIC CORE TYPE PRINTED BOARD, ITS MANUFACTURE, AND ELECTRIC CIRCUIT BOARD
THERMIONIC ELEMENT FOR HIGH TEMPERATURE
MIS FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURE
LEAD FRAME AND RESIN SEALED SEMICONDUCTOR DEVICE
FORMATION OF CONDUCTOR PATTERN OF INTEGRATED CIRCUIT PACKAGE
SEMICONDUCTOR DEVICE
SOLID-STATE IMAGE PICKUP DEVICE AND ITS MANUFACTURE
SILICON OXIDE FILM FORMING METHOD
VAPOR GROWTH APPARATUS
MANUFACTURING METHOD FOR MAGNET ROLL
SOLENOID DRIVER
TEFLON PROCESSING DEVICE
METHOD FOR INSERTING WIRE IN WATERPROOF PLUG AND WIRE INSERTING JIG
RELAY TERMINAL STRIP
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
ALUMINUM ELECTROLYTIC CAPACITOR