NON-CONTACT MANUFACTURING METHOD FOR BOTH SIDE OF WAFER

摘要

PURPOSE: A non-contact type processing method for both sides of a wafer is provided to prevent damage to the wafer by processing the both sides of the wafer while transferring the wafer in a non-contact method by a robot arm. CONSTITUTION: One surface of a wafer is coated in a wafer processing station (S30). The wafer with the coated one surface is stored in a cassette station (S40). The position of the upper and lower surfaces of a robot arm is changed by rotating the robot arm through 180 degrees (S50). The wafer is floated upwards by placing the robot arm on the coated one surface of the wafer (S60). The other surface of the waver faces upwards after the rotation of 180 degrees to arrange the robot arm on the lower part of the wafer (S70). The other surface of the wafer is coated in the wafer processing station (S90). The wafer with the coated surfaces is stored in the cassette station (S100). [Reference numerals] (AA) Start; (BB) End; (S10) First floating step; (S100) Fourth transfer step; (S20) First transfer step; (S30) First processing step; (S40) Second transfer step; (S50) First rotation step; (S60) Second floating step; (S70) Second rotation step; (S80) Third transfer step; (S90) Second processing step