发明名称 |
Method for manufacturing tight electrical bushings through an encapsulating housing and encapsulating housing provided with at least one of said electrical bushings |
摘要 |
The method involves forming a through opening (31) in one of walls (21) of an encapsulation package, and soldering a plate (30) made of cofired ceramic on the opening, where the cofired ceramic plate includes electric connections transiting through the plate. The through opening is formed in the bottom of the package, and the cofired ceramic plate is soldered face-to-face on bottom (20) of the package, where the package is made of ferrous-nickel-cobalt (FeNiCo) alloy. An independent claim is also included for an encapsulation package. |
申请公布号 |
EP2618370(A1) |
申请公布日期 |
2013.07.24 |
申请号 |
EP20130150975 |
申请日期 |
2013.01.11 |
申请人 |
SOCIETE FRANCAISE DE DETECTEURS, INFRAROUGES- SOFRADIR |
发明人 |
COLBEAU, FRANCOIS |
分类号 |
H01L23/045;H01L23/047;H01L23/055;H01L23/492;H01L31/0203 |
主分类号 |
H01L23/045 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|