PCB USING FOR SEMICONDUCTOR MODULE

摘要

PURPOSE: A printed circuit board for a semiconductor module is provided to prevent damage and separation by including a tab terminal plated by electroplating. CONSTITUTION: A substrate body laminates a circuit wiring layers. Plated wires (124) are disposed at the top and bottom surfaces of the substrate body. The plated wires are extended to the edge of the substrate body. Tab terminals (120) have a line width which is broader than the plated-wires. The tab terminals are electrically connected with the circuit wiring layer.