发明名称 Method for fabricating semiconductor device
摘要 A method for forming a polysilicon layer includes forming an amorphous silicon layer over a substrate, performing a first thermal treatment of the amorphous silicon layer by performing an implantation with a gas that includes silicon (Si), and performing a second thermal treatment on the thermally treated layer at a temperature higher than a temperature of the first thermal treatment.
申请公布号 US8492250(B2) 申请公布日期 2013.07.23
申请号 US201113223609 申请日期 2011.09.01
申请人 KO EUN-JUNG;HYNIX SEMICONDUCTOR INC. 发明人 KO EUN-JUNG
分类号 C23C16/24 主分类号 C23C16/24
代理机构 代理人
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