发明名称 |
Method of hydrophobizing and patterning frontside surface of integrated circuit |
摘要 |
A method of hydrophobizing a frontside surface of an integrated circuit. The method includes the steps of: (a) depositing a hydrophobic polymeric layer onto the frontside surface; (b) depositing a protective metal film onto the hydrophobic polymeric layer; (c) depositing a sacrificial material onto the metal film; (d) patterning the sacrificial material; (e) etching through the metal film, the hydrophobic polymeric layer and the frontside surface; (f) performing MEMS processing steps on a backside of the integrated circuit; (g) subjecting the integrated circuit to an oxidizing plasma, wherein the metal film protects the hydrophobic polymeric layer from the oxidizing plasma; and (h) removing the protective metal film to provide an integrated circuit having a relatively hydrophobic patterned frontside surface.
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申请公布号 |
US8491803(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US201113212028 |
申请日期 |
2011.08.17 |
申请人 |
MCAVOY GREGORY JOHN;KERR EMMA ROSE;SILVERBROOK KIA;ZAMTEC LTD |
发明人 |
MCAVOY GREGORY JOHN;KERR EMMA ROSE;SILVERBROOK KIA |
分类号 |
G01D15/00 |
主分类号 |
G01D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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